Semiconductor hazards are addressed in specific OSHA standards for general industry. This section highlights OSHA standards and documents related semiconductors. 

OSHA Standards

Frequently Cited Standards

OSHA maintains a listing of the most frequently cited standards for specified 6-digit North American Industry Classification System (NAICS) codes. Please refer to OSHA's Frequently Cited OSHA Standards page for additional information. For Semiconductor and Related Device Manufacturing use NAICS code 334413 in the NAICS search box.

Other Highlighted Standards

General Industry (29 CFR 1910)
General Industry (29 CFR 1910)
Related Information

1910 Subpart H - Hazardous Materials

1910.124, General requirements for dipping and coating operations.

Related Information

1910 Subpart I - Personal Protective Equipment

1910.132, General requirements.

Related Information

1910.134, Respiratory protection.

Related Information

1910 Subpart Z - Toxic and Hazardous Substances

1910.1018, Inorganic arsenic.

Related Information

1910.1020, Access to employee exposure and medical records.

Related Information

1910.1025, Lead.

Related Information
State Plan Standards

There are 29 OSHA-approved State Plans operating state-wide occupational safety and health programs. State Plans are required to have standards and enforcement programs that are at least as effective as OSHA's and may have different or more stringent requirements.

Note: These are NOT OSHA regulations. However, they do provide guidance from their originating organizations related to worker protection.

Semiconductor Equipment and Materials International (SEMI)

  • Safety Guidelines
    • SEMI S1-0708E Safety Guideline for Equipment Safety Labels
    • SEMI S2-0712b Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
    • SEMI S3-1211 Safety Guideline for Process Liquid Heating Systems
    • SEMI S4-0304 Safety Guideline for the Separation of Chemical Cylinders Contained in Dispensing Cabinets
    • SEMI S5-0310 Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves
    • SEMI S6-0707E EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
    • SEMI S7-0310 Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications
    • SEMI S8-0712a Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment
    • SEMI S10-0307E Safety Guideline for Risk Assessment and Risk Evaluation Process
    • SEMI S12-0211 Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
    • SEMI S13-0113 Environmental, Health and Safety Guideline for Documents Provided to the Equipment User…
    • SEMI S14-0309 Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment
  • Facilities
    • SEMI F1-0812 Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
    • SEMI F4-0211 Specification for Pneumatically Actuated Cylinder Valves
    • SEMI F5-1101 Guide for Gaseous Effluent Handling
    • SEMI F6-92 Guide for Secondary Containment of Hazardous Gas Piping Systems
    • SEMI E16-0611 Guideline for Determining and Describing Mass Flow Controller Leak Rates
    • SEMI E17-1011 Guide for Mass Flow Controller Transient Characteristics Tests
    • SEMI E51-0200 Guide for Typical Facilities Services and Termination Matrix
    • SEMI E129-0912 Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility

National Fire Protection Association (NFPA)

  • 318, Standard for the Protection of Semiconductor Fabrication Facilities. (2009).