Occupational Safety and Health Administration OSHA

Plasma Etching Gases and Etched Materials (Table 3)

Material Gas
Polysilicon (Si) and Silicon CF + O2, CCL3 or CF3Cl, CF4 and HCl
Silicon Dioxide (SiO2) C2F6, C3F8, CF4, SiF4, C5F12, CHF3,
CCl2F2, SF6, HF
Silicon Nitride (Si3N4) CF4 + Ar, CF4 + O2, CF4 + H2
Aluminum (Al) CCl4 or BCl3 + He or Ar
Chromium (Cr) CCl4
Chromium Oxide (CrO3) Cl2 + Ar or CCl4 + Ar
Gallium Arsenide (GaAs) CCl2F2
Vanadium (V)
Titanium (Ti)
Tantalum (Ta)
Molybdenum (Mo)
Tungsten (W)
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