Occupational Safety and Health Administration OSHA

Non-Fabrication Processing

Wafer Sort and Test

After fabrication is completed, each finished wafer undergoes a sort process where the integrated circuitry on each specific die is electrically tested with computer-controlled probes. Each wafer may contain up to hundreds of separate dies or chips which are tested. Devices that fail the test are marked with a colored dye and sorted accordingly.

The following are the potential hazards of wafer sort and testing.

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