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Metallization

Backlapping and Backside Metallization

A final processing step called backlapping is sometimes performed. The backside of the wafer may be lapped or ground down using a wet abrasive solution under pressure. Backside metallization with a metal such as gold may be deposited on the back of the wafer with sputtering. This makes attachment of the separated die to the package easier in the final assembly.

The following are the potential hazards of backlapping and backside metallization.

Metals

Potential Hazard

  • Possible employee exposure to metals used for backside metallization.

Possible Solutions

  • Identify metal hazards and perform appropriate exposure evaluations.
    • Perform exposure measurements for the compounds used.
    • Keep exposures below acceptable exposure levels.
  • Address all dermal exposures.
  • Provide appropriate ventilation to reduce concentration levels in the air.
  • Provide PPE as appropriate to prevent contact. [29 CFR 1910 Subpart I]
  • Use respiratory protection when necessary to further reduce exposure and protect employees. [29 CFR 1910.134]
  • Maintain adequate housekeeping to remove unwanted metals and reduce concentration levels.

Additional Information

OSHA Safety and Health Topics Pages:

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