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Wafer Processing

Ingot Evaluation and Machining

As in silicon ingot processing, the crystalline structure of the GaAs ingot is determined by the use of an x-ray diffraction unit. The ends of the single-crystal ingot are then cropped using a water-lubricated single-bladed diamond saw, with various coolants added to the water.

The following are potential hazards of ingot evaluation and machining.


Potential Hazard

  • Possible employee exposure to gallium arsenide (arsenic). The GaAs slurry presents a considerable dermal hazard, and there is potential for an airborne hazard if the slurry becomes dry.

Possible Solutions

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