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Device Fabrication

Metallization

An initial aluminum evaporation is performed utilizing an e-beam evaporator. After backlapping (see below), gold evaporation is performed using a filament evaporator. (See Silicon Device Manufacturing - Metallization)

The following are potential hazards of metallization.

Metals and Solvents

Potential Hazard

  • Possible employee exposure to metals and solvents during evaporator cleaning, bell jar cleaning, and maintenance operations. Typical metal exposures include gold and silver. Methanol is a popular cleaning solvent.

Possible Solutions

Additional Information

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