Occupational Safety and Health Administration OSHA

Device Fabrication


Backlapping is done to remove deposited materials (GaAsP, Si3N4, etc.) from the backside of the wafer. The wafers are wax-mounted to a lapper plate and wet-lapped with a colloidal silica slurry. Then the wax is removed by wet-stripping the wafers in an organic stripper containing phenol, sulfonic acid, and chlorobenzenes in a locally exhausted wet chemical etch station. The wafers then receive a final cleaning. (See Silicon Device Manufacturing - Metallization - Backlapping and Backside Metallization)

The following are potential hazards of backlapping.


Potential Hazard

  • Possible employee exposure to chemicals used for wet chemical etching. Common chemicals include phenol, sulfonic acid, and chlorobenzenes.

Possible Solutions

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