Plasma Etching Gases and Etched Materials (Table 3)
| Material | Gas |
|---|---|
| Silicon | |
| Polysilicon (Si) and Silicon | CF + O2, CCL3 or CF3Cl, CF4 and HCl |
| Silicon Dioxide (SiO2) | C2F6, C3F8, CF4, SiF4, C5F12, CHF3, CCl2F2, SF6, HF |
| Silicon Nitride (Si3N4) | CF4 + Ar, CF4 + O2, CF4 + H2 |
| Metals | |
| Aluminum (Al) | CCl4 or BCl3 + He or Ar |
| Chromium (Cr) | CCl4 |
| Chromium Oxide (CrO3) | Cl2 + Ar or CCl4 + Ar |
| Gallium Arsenide (GaAs) | CCl2F2 |
| Vanadium (V) Titanium (Ti) Tantalum (Ta) Molybdenum (Mo) Tungsten (W) |
CF4 |