Safety and Health Topics > Semiconductors > Silicon
> Substrate Manufacture: Single Crystal Ingot Growth
Substrate Manufacture:
Single Crystal Ingot Growth
Almost all crystal growth is done by the Czochralski (Cz) method. This method begins by heating electronic-grade
polycrystalline silicon in a quartz crucible to 1200ºC in an argon atmosphere. Either radiofrequency (RF) or
resistance heating is used. A starter or "seed" crystal of silicon is placed onto the end of a rod and
dipped into the melt to form the crystal. The seed and crucible are rotated in opposite directions while the seed is
withdrawn. Silicon atoms attach to the rod and the crystal grows in size. Careful control of temperature, rotation
speed, and vertical withdrawal determines the size of the ingot. Different atmospheres (inert, oxidizing, reducing)
and pressures (vacuum, high pressure) also are maintained in the growth chamber depending on the type of crystal
desired.
Controlled amounts of impurities are added during crystal growth to establish the desired electrical properties
for the silicon. The melt is usually "doped" with elements like boron, phosphorous, arsenic, or antimony.
Potential Hazards
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Metals and Salts |
Potential Hazard
- Possible employee exposure to various metals and salts used for elemental
dopants, including phosphorous, boron, arsenic,
antimony, magnesium, etc.
Possible Solutions
- Identify metal hazards and perform appropriate exposure evaluations.
- Perform exposure measurements for the compounds used.
- Keep exposures below acceptable exposure levels.
- Address all dermal exposures.
- Provide appropriate ventilation to reduce concentration levels in air.
- Provide PPE [1910
Subpart I] as appropriate to prevent contact.
- Use respiratory protection [1910.134] when necessary to further reduce exposure and protect employees.
- Maintain adequate housekeeping to remove unwanted metals and reduce
concentration levels.
Additional Information
OSHA Safety and Health Topic pages:
OSHA Health Guidelines page:
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