Section 5(a)(1) of the OSH Act, often referred to as the General Duty Clause, requires employers to "furnish to each of his employees employment and a place of employment which are free from recognized hazards that are causing or are likely to cause death or serious physical harm to his employees". Section 5(a)(2) requires employers to "comply with occupational safety and health standards promulgated under this Act".

Note: Twenty-four states, Puerto Rico and the Virgin Islands have OSHA-approved State Plans and have adopted their own standards and enforcement policies. For the most part, these States adopt standards that are identical to Federal OSHA. However, some States have adopted different standards applicable to this topic or may have different enforcement policies.

General Industry (29 CFR 1910)

• 1910 Subpart H, Hazardous materials
  • 1910.124, General requirements for dipping and coating operations
• 1910 Subpart I, Personal protective equipment
  • 1910.132, General requirements [related topic page]
  • 1910.134, Respiratory protection [related topic page]
• 1910 Subpart Z, Toxic and hazardous substances [related topic page]
  • 1910.1018, Inorganic arsenic [related topic page]
  • 1910.1020, Access to employee exposure and medical records
  • 1910.1025, Lead [related topic page]

Note: These are NOT OSHA regulations. However, they do provide guidance from their originating organizations related to worker protection.

• Safety Guidelines
  • SEMI S1-0701, Safety Guidelines for Equipment Safety Labels
  • SEMI S2-1102, Safety Guidelines for Semiconductor Manufacturing Equipment
  • SEMI S3-91, Safety Guidelines for Heated Chemical Baths
  • SEMI S4-92, Safety Guideline for the Segregation/Separation of Gas Cylinders Contained in Cabinets
  • SEMI S5-93, Safety Guideline for Flow Limiting Devices
  • SEMI S6-93, Safety Guideline for Ventilation
  • SEMI S7-96, Safety Guideline for Environmental, Safety, and Health (ESH) Evaluation of Semiconductor Manufacturing Equipment
  • SEMI S8-0701, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment
  • SEMI S9-1101, Safety Guidelines for Electrical Design Verification Tests for Semiconductor Manufacturing Equipment
  • SEMI S10-1296, Safety Guideline for Risk Assessment
  • SEMI S11-1296, Environmental, Safety, and Health Guidelines for Semiconductor Manufacturing Equipment Minienvironments
  • SEMI S12-0298, Guidelines for Equipment Decontamination
  • SEMI S13-0298, Safety Guidelines for Operation and Maintenance Manuals Used with Semiconductor Manufacturing Equipment
  • SEMI S15-0200, Safety Guideline for the Evaluation of Toxic and Flammable Gas Detection Systems
  • SEMI F1-96, Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
  • SEMI F2-94, Specification for 316L Stainless Steel Tubing for General Purpose Semiconductor Manufacturing Applications
  • SEMI F3-94, Guide for Welding Stainless Steel Tubing for Semiconductor Manufacturing Applications
  • SEMI F4-1000, Specification for Pneumatically Actuated Cylinder Valves
  • SEMI F5-1101, Guide for Gaseous Effluent Handling
  • SEMI F6-92, Guide for Secondary Containment of Hazardous Gas Piping Systems
  • SEMI F7-92, Test Method to Determine the Tensile Strength of Tube Fitting Connections Made of Fluorocarbon Materials
  • SEMI F8-0998, Test Method for Evaluating the Sealing Capabilities of Tube Fitting Connections Made of Fluorocarbon Materials When Subjected to Tensile Forces
  • SEMI F9-0998, Test Method to Determine the Leakage Characteristics of Tube Fitting Connections Made of Fluorocarbon Materials When Subjected to a Side Load Condition
  • SEMI F10-0698, Test Method to Determine the Internal Pressure Required to Produce a Failure of a Tube Fitting Connection Made of Fluorocarbon Materials
  • SEMI F11-0998, Test Method to Obtain an Indication of the Thermal Characteristics of Tube Fitting Connections Made of Fluorocarbon Materials
  • SEMI F12-0998, Test Method to Determine the Sealing Capabilities of Fittings, Made of Fluorocarbon Material, after Being Subjected to a Heat Cycle
  • SEMI F13-1101, Guide for Gas Source Control Equipment
  • SEMI F14-93, Guide for the Design of Gas Source Equipment Enclosures
  • SEMI F15-93, Test Method for Enclosures Using Sulfur Hexafluoride Tracer Gas and Gas Chromatography
  • SEMI F16-94, Specification for 316L Stainless Steel Tubing Which Is to Be Finished and Electropolished for High Purity Semiconductor Manufacturing Applications
  • SEMI F17-95, Specification for High Purity Quality Electropolished 316L Stainless Steel Tubing, Component Tube Stubs, and Fittings Made from Tubing
  • SEMI F18-95, Guide for Determining the Hydrostatic Strength of, and Design Basis for, Thermoplastic Pipe and Tubing
  • SEMI F19-95, Specification for the Finish of the Wetted Surfaces of Electropolished 316L Stainless Steel Components
  • SEMI F20-0997, Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in the High Purity Semiconductor Manufacturing Applications
  • SEMI F21-1102, Classification of Airborne Molecular Contaminant Levels in Clean Environments
  • SEMI F22-1102, Guide for Gas Distribution Systems
  • SEMI F23-0697, Particle Specification for Grade 10/0.2 Flammable Specialty Gases
  • SEMI F24-0697, Particle Specification for Grade 10/0.2 Inert Specialty Gases
  • SEMI F30-0298, Start-Up and Verification of Purifier Performance Testing for Trace Gas Impurities and Particles at an Installation Site
  • SEMI F31-0698, Guide for Bulk Chemical Distribution Systems
  • SEMI F32-0998, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves
  • SEMI F33-0998, Method for Calibration of Atmospheric Pressure Ionization Mass Spectrometer (APIMS)
  • SEMI F34-0998, Guide for Liquid Chemical Pipe Labeling
  • SEMI F35-0998, Test Method for Ultra-High Purity Gas Distribution System Integration Verification Using Non-Invasive Oxygen Measurement
  • SEMI F36-0299, Guide for Dimensions and Connections of Gas Distribution Components
  • SEMI F37-0299, Method for Determination of Surface Roughness Parameters for Gas Distribution System Components
  • SEMI F38-0699, Test Method for Efficiency Qualification of Point-of-Use Gas Filters
  • SEMI F39-0699, Guideline for Chemical Blending Systems
  • SEMI F40-0699, Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing
  • SEMI F41-0699, Guide for Qualification of a Bulk Chemical Distribution System Used in Semiconductor Processing
  • SEMI F42-0600, Test Method for Semiconductor Processing Equipment Voltage Sag Immunity
  • SEMI F43-0699, Test Method for Determination of Particle Contribution by Point-of-Use Purifiers
  • SEMI F44-0699, Guideline for Standardization of Machined Stainless Steel Weld Fittings
  • SEMI F45-0699, Guideline for Standardization of Machined Stainless Steel Reducing Weld Fittings
  • SEMI F46-0999, Guide for On-Site Chemical Generation (OSCG) Systems
  • SEMI F47-0200, Specification for Semiconductor Processing Equipment Voltage Sag Immunity
  • SEMI F48-0600, Test Method for Determining Trace Metals in Polymer Materials
  • SEMI F49-0200, Guide for Semiconductor Factory Systems Voltage Sag Immunity
  • SEMI F50-0200, Guide for Electric Utility Voltage Sag Performance for Semiconductor Factories
  • SEMI PR3-0699E, Proposed Specification for Surface Mount Interface of Gas Distribution Components
  • SEMI E16-90, Guideline for Determining and Describing Mass Flow Controller Leak Rates
  • SEMI E51-0200, Guide for Typical Facilities Services and Termination Matrix
  • SEMI E76-0299, Guide for 300 mm Process Equipment Points of Connection to Facility Services
  • SEMI E80-0299, Test Method for Determining Attitude Sensitivity of Mass Flow Controllers (Mounting Position)

• ESH Documentation for Suppliers. Provides a list of guidance documents including guidelines for factory design, user requirements, software requirements, and equipment performance.

• 318, Standard for the Protection of Semiconductor Fabrication Facilities. (2009).