Safety and Health Topics > Semiconductors > Silicon
> Non-Fabrication Processing: Packaging and Encapsulation
Non-Fabrication Processing: Packaging and Encapsulation
After wire bonding is completed, the combined components are placed into a molding press and encapsulated in
either ceramic or plastic materials. Final computer tests are then performed to evaluate whether the product meets
specifications. According to test performance, the packages are separated into low- and high-quality circuits. The
finished product is then packaged, labeled, and shipped to the customer.
Potential Hazards
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Plastic Resins, Hardeners, and
Fillers |
Potential Hazard
- Possible employee exposure to plastic resins, hardeners, and fillers used for
encapsulation.
Possible Solutions
- Identify chemical hazards and perform appropriate exposure evaluations.
- Perform exposure measurements for the solvents used.
- See 1910.1000, Table
Z-1, which contains permissible exposure limits for various chemicals.
- Address all dermal exposures.
- Provide appropriate ventilation to reduce solvent concentration levels in the air.
- Provide PPE [1910
Subpart I] as appropriate to prevent eye and skin contact.
- Use respiratory protection [1910.134] when necessary to further reduce exposure and protect employees.
Additional Information
OSHA Safety and Health Topic pages:
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UV Radiation |
Potential Hazard
- Possible employee exposure to ultraviolet (UV) radiation from certain types
of testing equipment.
Possible Solutions
- Identify UV hazards; perform exposure evaluations when applicable.
- Enclose
operations with UV emissions; provide shielding and interlocks as necessary.
- Provide
PPE [1910 Subpart I] as
appropriate during operations when exposure is necessary.
- Implement UV radiation safety programs to further identify and control UV
hazards.
- Provide adequate ventilation to control ozone concentrations, which may be generated from UV radiation.
Additional Information
OSHA Safety and Health Topic pages:
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