U.S. Department of Labor
	Occupational Safety & Health Administration
	www.osha.gov		[skip navigational links]	Search	Advanced Search | A-Z Index

Safety and Health Topics > Semiconductors > Silicon > Non-Fabrication Processing: Die Separation Non-Fabrication Processing: Die Separation After sorting and testing, the individual dies are physically separated. Diamond scribing, laser scribing, and diamond wheel sawing are used for die separation. Diamond scribing is the oldest method and involves scoring a line across the wafer surface with a diamond tip. The wafer is then bent along the line, causing a fracture and separation. Laser scribing is similar except that a laser is used to score the fracture line. Diamond sawing involves wet-cutting the substrates with a high-speed circular diamond saw. Sawing may be used to either partially cut and scribe the surface, or can be used to completely cut through the wafer. Potential Hazards Machinery Lasers Vaporization Products - Laser Scribing Vaporization Products - Laser Scribing Potential Hazard Possible employee exposure to vaporization products from laser scribing. Possible Solutions Identify vaporization hazards and perform appropriate exposure evaluations. Perform exposure measurements for the solvents used. See 1910.1000, Table Z-1, which contains permissible exposure limits for various chemicals. Provide appropriate ventilation to reduce concentration levels in the air. Use respiratory protection [1910.134] when necessary to further reduce exposure and protect employees. Additional Information OSHA Safety and Health Topic pages: Health Guidelines Respiratory Protection Sampling and Analysis Ventilation

Back to Top www.osha.gov	www.dol.gov
Contact Us | Freedom of Information Act | Customer Survey Privacy and Security Statement | Disclaimers
Occupational Safety & Health Administration 200 Constitution Avenue, NW Washington, DC 20210