Occupational Safety and Health Administration OSHA

Device Fabrication


Following exposure, the wafers are developed with aqueous solutions of either sodium hydroxide or potassium hydroxide. The developer is applied by either immersion, spraying, or atomization, causing the unpolymerized areas of the photoresist to be dissolved and removed. Various developer solutions are identified in Table 1. A solvent rinse (n-butyl acetate, IPA, acetone, etc.) is usually applied following the developer to remove any residual material.

The following are the potential hazards of developing.

Caustic Solutions and Aerosols

Potential Hazard

  • Possible employee exposure to caustic solutions and aerosols used during developing. Typical caustics include NaOH and KOH.

Possible Solutions

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