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Safety and Health Topics > Semiconductors > Non-Fabrication Processing: Wafer Sort and Test

Non-Fabrication Processing: Wafer Sort and Test
Probe test
Courtesy Micron Technology, Inc.
After fabrication is completed, each finished wafer undergoes a sort process where the integrated circuitry on each specific die is electrically tested with computer-controlled probes. Each wafer may contain up to hundreds of separate dies or chips which are tested. Devices that fail the test are marked with a colored dye and sorted accordingly.

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