U.S. Department of Labor
	Occupational Safety & Health Administration
	www.osha.gov		[skip navigational links]	Search	Advanced Search | A-Z Index

Safety and Health Topics > Semiconductors > Silicon > Metallization: Backlapping and Backside Metallization Metallization: Backlapping and Backside Metallization A final processing step called backlapping is sometimes performed. The backside of the wafer may be lapped or ground down using a wet abrasive solution under pressure. Backside metallization with a metal such as gold may be deposited on the back of the wafer with sputtering. This makes attachment of the separated die to the package easier in the final assembly. Potential Hazards Nuisance Dust Machinery RF Radiation Metals Metals Potential Hazard Possible employee exposure to metals used for backside metallization. Possible Solutions Identify metal hazards and perform appropriate exposure evaluations. Perform exposure measurements for the compounds used. Keep exposures below acceptable exposure levels. Address all dermal exposures. Provide appropriate ventilation to reduce concentration levels in the air. Provide PPE [1910 Subpart I] as appropriate to prevent contact. Use respiratory protection [1910.134] when necessary to further reduce exposure and protect employees. Maintain adequate housekeeping to remove unwanted metals and reduce concentration levels. Additional Information OSHA Safety and Health Topic pages: Dermal Exposure Permissible Exposure Limits (PELs) Personal Protective Equipment (PPE) Respiratory Protection Sampling and Analysis Toxic Metals Ventilation

Back to Top www.osha.gov	www.dol.gov
Contact Us | Freedom of Information Act | Customer Survey Privacy and Security Statement | Disclaimers
Occupational Safety & Health Administration 200 Constitution Avenue, NW Washington, DC 20210