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Safety and Health Topics > Semiconductors > Gallium Arsenide > Wafer Processing: Ingot Evaluation... Wafer Processing: Ingot Evaluation and Machining As in silicon ingot processing, the crystalline structure of the GaAs ingot is determined by the use of an x-ray diffraction unit. The ends of the single-crystal ingot are then cropped using a water-lubricated single-bladed diamond saw, with various coolants added to the water. Potential Hazards X-Ray Radiation Machinery Arsenic Arsenic Potential Hazard Possible employee exposure to gallium arsenide (arsenic). The GaAs slurry presents a considerable dermal hazard, and there is potential for an airborne hazard if the slurry becomes dry. Possible Solutions See the Possible Solutions: Arsenic page.

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