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U.S. Department of Labor |
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| Occupational Safety & Health Administration | ||||||
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Semiconductors
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Gallium Arsenide
> Ingot Growing: Introduction
Ingot Growing: Introduction In the Gallium Arsenide ingot and wafer growth process, elemental forms of gallium (Ga) and arsenic (As), plus small quantities of dopant material (silicon, tellurium, or chromium) react at elevated temperatures to form ingots of doped single crystal GaAs. Three generalized methods of ingot production are used:
Another approach to the commercial production of bulk single-crystal GaAs that is gaining favor is the liquid encapsulated Czochralski technique (LEC Cz). A Cz crystal puller is loaded with chunk GaAs in a quartz ampoule with an outer graphite receptor. The bulk GaAs melts at temperatures close to 1238șC, and the crystal is pulled in a pressurized atmosphere of approximately 100 atm. A viscous glass, B2O3, completely encapsulates the melt, which prevents melt dislocation when the dissociation vapor (As) is less than or equal to the pressure of an inert gas (argon, typically) applied in the puller chamber. The following description delineates processing steps in use in LED production facilities. The Horizontal Bridgeman (HB) and Gradient Freeze (GF) methods of single-crystal gallium arsenide ingot growth are the dominant techniques in use in LED production. |
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