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U.S. Department of Labor |
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| Occupational Safety & Health Administration | ||||||
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| Safety and Health
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Semiconductors
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Gallium Arsenide
> Ingot Growing: Ingot and Remelt...
Ingot Growing: Ingot and Remelt Sandblasting/Cleaning The single-crystal GaAs ingots and polycrystalline defects must be sandblasted and cleaned to remove exterior oxides and contaminants. The sandblasting is done in a glove-box type bead blaster utilizing either silicon carbide or calcined alumina blasting media. Wet cleaning is done in wet chemical baths provided with local exhaust ventilation and utilizing HCl/HNO3 or alcohol rinses (isopropyl and/or methyl). Potential Hazards
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