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Safety and Health Topics > Semiconductors > Silicon > Device Fabrication: Cleaning Device Fabrication: Cleaning The need for a particulate and contamination-free wafer surface requires frequent cleaning. The major types of cleaning are: Deionized water and detergent scrubbing. Solvent: isopropyl alcohol (IPA), acetone, ethanol, terpenes. Acid: HF, H2SO4 and H2O2, HCl, HNO3, and mixtures. Caustic: NH4OH Potential Hazards Solvents Acids and Caustic Solutions Acids and Caustic Solutions Potential Hazard Possible employee exposure to acid and caustic solutions used during cleaning. Typical acids may include mixtures of HF, H2SO4, H2O2, HCl, and HNO3. Caustic solutions include mainly NH4OH. Possible Solutions See the Possible Solutions: Acids and Caustics page. Additional Information OSHA Health Guidelines pages: Hydrogen Chloride Hydrogen Fluoride Hydrogen Peroxide

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